QIANLI 4IN1 MID FRAME REBALLING PLATFORM FOR IPHONE 13/13MINI/13PRO/13PROMAX
DESCRIPTION: QIANLI IPHONE MIDDLE FRAME REBALLING PLATFORM FOR IPHONE 13 MOTHERBOARD SOLDERING TOOL, QIANLI IPHONE MIDDLE FRAME REBALLING PLATFORM FOR IPHONE 13 LOGIC BOARD DISSEMBLING AND ASSEMBLING TESTING TOOL. QIANLI MIDDLE FRAME REBALLING PLATFORM FOR IPHONE13 SEPARATING.
BRAND: QIANLI | TOOLPLUS COMPATIBILITY IPHONE MODELS: * IPHONE 13 * IPHONE 13 MINI * IPHONE 13 PRO * IPHONE 13 PRO MAX Stencils with no bulge under high temperature High temperature magnetic strong pressing, Prevent the stencils from bulging caused by high temperatur. Applicable motherboard models 4 in 1 Suitable for Phone Series 12 (4 models) motherboard 1/4 中层植锡网[4IN1】 3/4 中层植锡网 [41N1】 Phone 13 Phone 13 Pro .4 IINVIO Phone 13 INVD (Phone 13 Pro 4/4 中层植锡网【4IN1】 2/4 中层植锡网(4IN1) Phone 13 Pro Max Phone 13 Mini ( Phone 13 Pro Max 『 11NMID Phone 13 Mini
Made of imported high quality steel material Imported selection of high quality steel material
Manufacture under QianLi black stencils standard Wear resistance, ultra high toughness to support reballing
Precise positioning for the motherboard CC high-precision integrated processing Stable positioning for the motherboard No deviation in reballing
User's Guide Shows mo Install the motherboard: Put the lower layer of motherboard that needs reballing to the corresponding positioning pinsPlace it in the synthetic stone base JANLiCEA® 14 中层植锡网 [4INI】 Install stencils: Align the stencils of the corresponding model with the positioning pins and put it into the base ne 13 Apply solder paste: Apply the solder paste at the corresponding temperature to the reballing hole, make sure that each hole is covered with solder paste Heat evenlv: Combine the top cover of the product with the base and operate Use the hot air gun to heat
Round and plump tin balls Square chamfer mesh, prevent the tin balls from being stuck in the mesh
Strong magnetic pressing prevent the stencils from bulging and deforming effectively Press the stencils to prevent deformation more convenient operation in reballing
Magnet sliding dislocation design smart application of the sliding dislocation design easy to take
Double-Side Reballing Four in One Middle Frame Reballing Platform Precise positioning for the motherboard in high Phone13 13Pro 13Pro Max 13Mini d Sliding dislocation design LIANIE 中层植锡平台a1N1 13/13Pro/13ProMax/13Mini * Strong magnetic adsorption * Precise positioning * Fast and convenient * Selected material
Product Size 60*100*18.4mm Packing Size 62*102*20.4mm Features Motherboard reballing, repair Size Unit millimeter (mm) Material synthetic stone, steel Product Weight 158.6g Model Phone 13 / 13 Pro / 13 Pro Max / 13 Mini
