• CAN MAKE THE RESISTANCE IN THE WELDING PROCESS AUXILIARY ACCURATE RETURN, PROFESSIONAL SOLUTION QFN / BGA HOLLOW BUBBLE, DENSE FOOT IC RESIDUE AND SO • IN THE WELDING, CAN MAKE THE PARENT METAL SURFACE OXIDE REDUCTION, EFFECTIVELY ELIMINATE THE OXIDE FILM • HIGH TEMPERATURE WELDING, EFFECTIVELY PREVENT OXIDATION REACTION. • TO A GREATER EXTENT REDUCE THE MATERIAL SURFACE TENSION, IMPROVE WETTING PERRORMANCE • AT THE SAME TIME CAN BE WIDELY USED IN WATCHES AND CLOCKS. PRECISION COMPONENTS, MEDICAL EQUIPMENT, MOBILE COMMUNICATIONS, DIGITAL PRODUCTS, ALL KINDS OF PCB BOARD AND BGA WELDING • CAN MAKE THE RESISTANCE IN THE WELDING PROCESS AUXILIARY ACCURATE RETURN, PROFESSIONAL SOLUTION QFN / BGA HOLLOW BUBBLE, DENSE FOOT IC RESIDUE AND SO • IN THE WELDING, CAN MAKE THE PARENT METAL SURFACE OXIDE REDUCTION, EFFECTIVELY ELIMINATE THE OXIDE FILM • HIGH TEMPERATURE WELDING, EFFECTIVELY PREVENT OXIDATION REACTION. • TO A GREATER EXTENT REDUCE THE MATERIAL SURFACE TENSION, IMPROVE WETTING PERFORMANCE • AT THE SAME TIME CAN BE WIDELY USED IN WATCHES AND CLOCKS, PRECISION COMPONENTS, MEDICAL EQUIPMENT, MOBILE COMMUNICATIONS, DIGITAL PRODUCTS, ALL KINDS OF PCB BOARD AND BGA WELDING
